Microbonds

company

About

Microbonds develops insulated bonding wire technology for the semiconductor packaging and microchip industries.

  • 11 - 50

Details

Last Funding Type
Grant
Last Funding Money Raised
$334K
Industries
Industrial,Manufacturing,Semiconductor
Founded date
Jan 1, 1999
Number Of Employee
11 - 50
Operating Status
Active

Microbonds is a pioneer and leader in the research, development and application of gold and copper insulated bonding wire technology for the semiconductor packaging and microchip industries. Microbonds' proprietary chemistry invention is a key to this breakthrough that is poised to sustain and extend an existing US$20B+ wire bond infrastructure and US $4B+ consumables marketplace. Microbonds technology is proven on coated gold bonding wire and is well positioned to capitalize on the growing market demand for coated copper bonding wires.

Funding Rounds

Number of Funding Rounds
Total Funding Amount
1
$334K
Microbonds has raised a total of $334K in funding over 2 rounds. Their latest funding was raised on Apr 14, 2022 from a Grant round.
Announced Date Round Money Raised Number of Investors Lead Investors Post Valuation
Apr 14, 2022 Grant $334K 1 Ontario Together Fund Detail

Investors

Number of Lead Investors
Number of Investors
1
1
Microbonds is funded by 1 investors. Ontario Together Fund are the most recent investors.
Investor Name Lead Investor Funding Round
Ontario Together Fund Yes Grant