Microbonds develops insulated bonding wire technology for the semiconductor packaging and microchip industries.
Microbonds is a pioneer and leader in the research, development and application of gold and copper insulated bonding wire technology for the semiconductor packaging and microchip industries. Microbonds' proprietary chemistry invention is a key to this breakthrough that is poised to sustain and extend an existing US$20B+ wire bond infrastructure and US $4B+ consumables marketplace. Microbonds technology is proven on coated gold bonding wire and is well positioned to capitalize on the growing market demand for coated copper bonding wires.
Announced Date | Round | Money Raised | Number of Investors | Lead Investors | Post Valuation | |
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Apr 14, 2022 | Grant | $334K | 1 | Ontario Together Fund | — | Detail |
Investor Name | Lead Investor | Funding Round |
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Ontario Together Fund | Yes | Grant |